TE Connectivity 3-1775 Series Right Angle Board PCB Header, 24 Contact(s), 2 mm Pitch, 2 Row(s), Shrouded

Subtotal (1 tray of 150 units)*

£282.46

(exc. VAT)

£338.95

(inc. VAT)

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1 +£282.46£1.883

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RS Stock No.:
476-941
Mfr. Part No.:
2-292138-4
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

3-1775

Pitch

2mm

Current

4A

Housing Material

Polyamide 66

Number of Contacts

24

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Brass

Contact Plating

Tin Plated

Row Pitch

2mm

Minimum Operating Temperature

30°C

Termination Type

Solder

Tail Pin Length

3.2mm

Maximum Operating Temperature

105°C

Mating Pin Length

4.7mm

Standards/Approvals

RoHS

Voltage

125 V

Distrelec Product Id

304-53-804

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is designed for efficient wire-to-board connections, boasting a right angle configuration that maximises use of space. With 24 positions and a 2 mm centreline, it provides reliable and secure electrical connections for various applications. The fully shrouded design ensures robust protection for the terminals, while the tin (Sn) plating enhances resistance to corrosion and wear. Ideal for both power and signal applications, this connector facilitates simple integration into printed circuit boards through its through-hole solder termination method. Its compact dimensions and natural nylon housing make it versatile for various environments, further solidifying its role in essential electrical setups.

Optimised for tight layouts with a right angle orientation

Provides excellent protection for sensitive terminals

Facilitates straightforward PCB integration with through hole soldering

Natural nylon housing offers durability in diverse applications

Designed to support both power and signal circuits effectively

Allows for uncomplicated mechanical assembly with no mating retention

Compatible with industry standards ensuring adaptability across various platforms

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