TE Connectivity Z-PACK Series Vertical Board PCB Header, 30 Contact(s), 2.5 mm Pitch, 6 Row(s), Shrouded

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Subtotal (1 tube of 40 units)*

£382.55

(exc. VAT)

£459.06

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£382.55£9.564

*price indicative

RS Stock No.:
476-571
Mfr. Part No.:
5120732-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

Z-PACK

Current

1.15A

Pitch

2.5mm

Housing Material

Fibreglass Polyester

Number of Contacts

30

Number of Rows

6

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.5mm

Maximum Operating Temperature

105°C

Tail Pin Length

3.7mm

Contact Gender

Male

Standards/Approvals

China RoHS 2, EU ELV, EU RoHS, UL 94V-0

Mating Pin Length

6.8mm

Voltage

250 V

Distrelec Product Id

304-48-913

COO (Country of Origin):
CN
The TE Connectivity 30 Position High Speed Backplane Connector is engineered for both versatility and robust performance in demanding electronic applications. Designed with a 6-row and 5-column configuration, this connector features a vertical, partially shrouded PCB mount header for enhanced space-saving efficiency. With its impressive 250 VAC operating voltage, it meets the needs of high-speed data transmission, making it a valuable asset in traditional backplane architecture. The product's thoughtful design facilitates easy installation through press-fit technology, ensuring secure contact with printed circuit boards. This connector is not only compliant with global environmental regulations but also boasts a low halogen content, affirming its environmentally-friendly credentials. Aimed at reliable signal integrity, this connector is ideal for engineers seeking dependable solutions that do not compromise on performance.

Offers a dual beam contact shape to enhance connectivity

Constructed from durable polyester with glass fibre reinforcement

Integrates mating alignment features for improved assembly precision

Supports an operating temperature range suitable for diverse environments

Ensures compatibility with traditional backplane system architectures

Provides a matte plated termination area for superior contact reliability

Features compliant tail design for added PCB mount retention

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