TE Connectivity Z-PACK HS3 Series Vertical Board Mount PCB Header, 50 Contact(s), 2.5mm Pitch, 10 Row(s), Shrouded

The TE Connectivity 50 Position High Speed Backplane Connector is a meticulously engineered solution designed for exceptional performance in demanding electronic applications. This connector features a vertical PCB mount header configuration, offering unparalleled space efficiency while maintaining robust connectivity. It is part of the Z-PACK HS3 series, known for its reliability and high-speed characteristics. With 10 rows and 5 columns of meticulously arranged contact pins, this connector ensures optimal signal integrity and maintains a compact footprint. It is designed to excel in a diverse range of environments, operating efficiently in temperatures ranging from -65 to 105 °C. The partially shrouded design not only enhances mating reliability but also simplifies installation, making it an ideal choice for modern high-speed backplane systems. This connector meets stringent industry standards for quality and safety, ensuring peace of mind in critical applications.

Designed for high-speed applications, ensuring minimal signal degradation
Vertical orientation provides efficient use of space in compact assemblies
Polarisation feature simplifies mating and enhances engagement reliability
Constructed with a rugged polyester housing for long-lasting performance
Nickel contact underplating ensures excellent conductivity and durability
Compatible with industry-standard PCB thickness for effortless integration
Low-halogen materials support environmental compliance for sustainable manufacturing
Rounded contact design optimises mating and reduces wear over time