TE Connectivity Z-PACK Series Vertical Board Mount PCB Header, 60 Contact(s), 2.5mm Pitch, 6 Row(s), Shrouded

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Subtotal (1 tube of 34 units)*

£274.40

(exc. VAT)

£329.28

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£274.40£8.071

*price indicative

RS Stock No.:
481-019
Mfr. Part No.:
5120678-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

Z-PACK

Pitch

2.5mm

Number of Contacts

60

Number of Rows

6

Body Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mounting Type

Board Mount

COO (Country of Origin):
CN
The TE Connectivity 60 Position High Speed Backplane Connector, part of the Z-PACK HS3 series, redefines connectivity solutions. Designed for printed circuit board (PCB) applications, this vertical, partially shrouded header enables efficient signal transmission and robust performance. With 60 positions spread across 6 rows and 5 columns, it accommodates high-density interconnections, simplifying the design while maximising efficiency. Its 2.5 mm centreline facilitates ease of integration into compact spaces, ensuring it meets modern electronic demands. This connector is not just about utility

it’s constructed from materials that provide durability and reliability, making it suitable for varied environments, from standard to extreme temperatures. Enhance your PCB projects with a truly versatile connector that exhibits both form and function.

Designed to terminate directly to printed circuit boards
Allows for easy integration in traditional backplane architectures
Features a robust dual beam contact shape for reliable connections
Employs a press-fit termination method for secure assembly
Incorporates ESD/HDI guide pin style aiding in precise alignment
Constructed with low halogen materials for enhanced environmental compliance
The compact design aids in reducing PCB real estate whilst ensuring high performance
Flexible operating temperature range making it suitable for diverse applications

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