TE Connectivity Z-PACK HS3 Series Vertical PCB Mount PCB Header, 60 Contact(s), 2.5mm Pitch, 6 Row(s), Shrouded

The TE Connectivity high-speed backplane connector is engineered for precision and reliability in demanding applications. With a robust six-row design featuring 60 positions and a partially shrouded vertical PCB mount configuration, this connector ensures secure and efficient connections in limited spaces. The Z-PACK HS3 model is tailored to accommodate traditional backplane architectures, facilitating seamless integration into various electronic systems. Designed for an operating voltage of up to 250 VAC, it delivers exceptional performance while maintaining a compact footprint. The combination of carefully selected materials and advanced engineering results in a connector that not only meets stringent industry standards but also provides low halogen content for reduced environmental impact. This product stands out for its ability to deliver both versatility and efficiency, catering to the evolving demands of modern electronic designs.

Utilises a dual beam contact shape for enhanced electrical performance
Incorporates a polarization alignment feature to ensure correct mating
Designed with support for through hole press-fit termination methods
Houses a PCB mount retention mechanism, adding to connection stability
Manufactured with a matte finish on contact termination area for improved solderability
Compatible with a wide array of applications, ensuring adaptability across various sectors
Constructed from durable polyester with glass fibre for extended operational life
Offers a recommended PCB thickness compatibility for optimal mounting
Meets both UL 94V-0 flammability ratings, ensuring safety and reliability