TE Connectivity AMPMODU Series Vertical Board PCB Header, 26 Contact(s), 2.54 mm Pitch, 2 Row(s), Shrouded

Subtotal (1 box of 20 units)*

£167.82

(exc. VAT)

£201.38

(inc. VAT)

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Per unit*
1 +£167.82£8.391

*price indicative

RS Stock No.:
473-224
Mfr. Part No.:
1-826469-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

5A

Number of Contacts

26

Housing Material

Polycyclohexylenedimethylene Terephthalate

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Zinc Alloy

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

260°C

Standards/Approvals

UL 94 V-0

Distrelec Product Id

304-53-558

COO (Country of Origin):
PL
The TE Connectivity PCB mount header is designed for vertical orientation in board-to-board connections, providing superior reliability and performance in electronic applications. With 26 positions and a 2.54 mm centreline, this connector facilitates efficient signal transmission and ensures compatibility across various devices. The partially shrouded design safeguards against accidental disconnections while enhancing accessibility for easier handling. Featuring gold-plated contacts for optimal conductivity and corrosion resistance, this product assures long-lasting durability in demanding environments. Its robust build quality not only withstands regular operational stresses but also meets stringent industry standards, making it an ideal choice for high-performance electronics.

Enables seamless board-to-board connections without compromising signal integrity

Engineered for high-density applications with multiple positions

Utilises a durable housing material that supports a high-temperature rating

Employs nickel and gold plating for enhanced electrical performance and protection

Supports through-hole solder termination for reliable PCB attachment

Offers easy alignment during mating to streamline assembly processes

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