Z-PACK Series Vertical Board Mount PCB Header, 72 Contact(s), 2mm Pitch, 12 Row(s), Unshrouded

Subtotal (1 tube of 4 units)*

£186.92

(exc. VAT)

£224.30

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£186.92£46.73

*price indicative

RS Stock No.:
505-917
Mfr. Part No.:
5120824-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

Z-PACK

Pitch

2mm

Number of Contacts

72

Number of Rows

12

Body Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mounting Type

Board Mount

COO (Country of Origin):
CN
The TE Connectivity hard metric male connector is engineered for superior performance in demanding applications where reliability is paramount. Designed for board-to-board connectivity, it features a robust construction, accommodating a wide range of data rates up to 1 Gb/s. The arrangement includes 72 positions distributed across 12 rows and 6 columns, supporting a fully loaded mating configuration. Its housing is crafted from durable polyester reinforced with glass fibre, providing both strength and resilience in challenging environments. The connector's vertical PCB mount orientation ensures easy integration into various designs, making it suitable for mezzanine backplane architectures. This product also adheres to critical industry standards and compliance directives, ensuring peace of mind for design engineers and manufacturers alike.

Utilises a through-hole press-fit termination method for secure PCB attachment
Features a mating alignment guide hole for proper connector positioning
The primary product colour is black, enhancing visibility within complex assemblies
Boasts a mating area length offering flexibility in design configurations
Constructed with phosphor bronze contacts for exceptional conductivity and durability
Offers a minimal contact current rating while ensuring reliable signal integrity
Packaging is efficient, available in a convenient tube method for easy handling
The design is compliant with the EU RoHS directive, promoting environmental sustainability
Ideal for applications requiring a compact footprint without compromising on performance

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