TE Connectivity Z-PACK Series Vertical Board Mount PCB Header, 125 Contact(s), 2mm Pitch, 5 Row(s), Unshrouded

The TE Connectivity hard metric backplane PCB mount header is designed to accommodate data rates of up to 1 Gb/s, making it an ideal choice for high-performance computing applications. With a robust construction featuring 25 columns and 5 rows, this connector supports a total of 125 positions, ensuring reliable signal integrity and efficient data transmission. The vertical design optimises space and simplifies board layout for modern electronic systems, while the grey housing provides a neutral aesthetic. This component is perfect for mezzanine configurations, guaranteeing a seamless interface between boards. Engineered from durable PBT GF material, it withstands extreme operating conditions ranging from -55 to 125 °C, establishing itself as a reliable solution for various environmental settings. Compatible with a range of TE’s Z-PACK connectors, it is tailored for those seeking quality and durability in their electronic connections.

Constructed for high-speed applications, supporting data rates up to 1 Gb/s
Designed with a total of 125 positions for flexible connectivity
Compatible with mezzanine architectures, optimising dense circuit board designs
Made from durable materials that resist thermal and physical stresses
Features an easy-to-use through-hole press-fit termination method
Available in a vertical mount orientation to enhance PCB layout efficiency
Engineered to comply with EU RoHS and ELV directives, ensuring environmental safety
Offers a dependable connection with a nickel underplating and gold plating for excellent conductivity