TE Connectivity Z-PACK Series Vertical Board Mount PCB Header, 154 Contact(s), 2mm Pitch, 7 Row(s), Unshrouded

The TE Connectivity Hard metric backplane PCB mount header offers a robust solution for seamless board-to-board connectivity in demanding applications. Designed with a 2mm centreline pitch, it accommodates up to 154 positions across a 22-column and 7-row configuration. Its versatility makes it ideal for mezzanine backplane architectures, ensuring reliable performance at data rates of up to 1 Gb/s. The product’s innovative design features a vertical orientation and is presented in an elegant grey finish, enabling easy integration into a variety of electronics systems. Built for durability, the header is compliant with key industry standards, ensuring it meets rigorous operational demands within diverse environments. With a temperature range from -55 to 125 °C, this connector is engineered to perform reliably in extreme conditions.

Utilises nickel underplating to ensure excellent conductivity
Designed to facilitate easy assembly with board mounting capabilities
Boasts a compact footprint while maintaining high performance
Withstands extreme temperatures, making it suitable for a wide range of applications
Equipped with signal application capabilities for reliable communications
Included in a series offering compatibility with various other connectors