TE Connectivity AMPMODU Series Vertical Board PCB Header, 24 Contact(s), 2.54 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 tube of 72 units)*

£198.44

(exc. VAT)

£238.13

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£198.44£2.756

*price indicative

RS Stock No.:
503-315
Mfr. Part No.:
1-535542-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Fibreglass Polyester

Number of Contacts

24

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold Plated

Contact Material

Phosphor Bronze

Minimum Operating Temperature

65°C

Termination Type

Solder

Row Pitch

2.54mm

Tail Pin Length

3.3mm

Contact Gender

Female

Maximum Operating Temperature

125°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

333 V

Distrelec Product Id

304-63-897

COO (Country of Origin):
CN
The TE Connectivity PCB mount receptacle offers a robust and reliable connection solution designed specifically for vertical board-to-board applications. With 24 positions and a 2.54 mm centerline spacing, it ensures seamless integration into your electronics, promoting efficient space utilisation and enhanced performance. The gold-plated contacts deliver exceptional conductivity and longevity, making it ideal for applications requiring frequent connections. Crafted from high-quality materials, this connector guarantees resilience against environmental stressors, ensuring stability across a broad operating temperature range. Its innovative design supports stacked configurations, providing versatility in various electronics projects. The receptacle is compatible with a range of modular connector systems, streamlining your design process and enhancing overall connectivity.

Offers exceptional conductivity due to gold-plated contacts

Designed for easy integration into compact electronic layouts

Supports both bottom and top mating entry locations

Facilitates board standoff solder processes for efficient assembly

Built to endure a wide operating temperature range from -65 to 125 °C

Constructed from durable materials to withstand mechanical stress

Allows for stackable arrangements to maximise circuit board space

Features parallel board-to-board configuration for straightforward applications

Complies with industry standards for enhanced reliability and safety

Available in a packaging quantity that suits both small and large-scale projects

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