TE Connectivity AMPMODU Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 box of 500 units)*

£179.05

(exc. VAT)

£214.86

(inc. VAT)

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Per unit*
1 +£179.05£0.358

*price indicative

RS Stock No.:
476-726
Mfr. Part No.:
5-146280-4
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

4

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Tin

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, RoHS, UL

Distrelec Product Id

304-50-889

COO (Country of Origin):
MX
The TE Connectivity PCB mount header is designed for vertical board-to-board applications, providing a reliable connector solution with a 4-position configuration. This component features a 2.54 mm centreline and is specifically engineered for breakaway functionality, ensuring seamless connectivity in various electronic circuits. It embodies a robust construction, utilising materials that withstand demanding conditions. With its through hole soldering method, this header is ideal for providing secure and stable connections, making it a vital component in diverse applications from consumer electronics to industrial equipment. Its black housing not only enhances aesthetics but also contributes to durability, while compliance with industry standards ensures trusted performance. Whether for new designs or replacements, this header remains a preferred choice among engineers striving for efficiency and quality.

Provides a dependable connection for board-to-board configurations

Optimised for high-speed signal applications

Self-aligning setup facilitates easier integration

Gold contacts enhance conductivity and resist corrosion

Compact design saves space on the PCB

Durable housing material withstands harsh environments

Compatible with multiple electronic assembly processes

Meets stringent compliance standards for safety and reliability

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