TE Connectivity AMPMODU Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 2 Row(s), Unshrouded

Subtotal (1 reel of 250 units)*

£437.72

(exc. VAT)

£525.26

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 08 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Reel(s)
Per Reel
Per unit*
1 +£437.72£1.751

*price indicative

RS Stock No.:
482-175
Mfr. Part No.:
5-147279-4
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Glass Filled Liquid Crystal Polymer

Number of Contacts

4

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-50-899

COO (Country of Origin):
US
The TE Connectivity PCB mount header is designed for vertical board-to-board connections, featuring a robust 4-position layout on a 2.54 mm centreline. Engineered to deliver high reliability, it incorporates a breakaway functionality ideal for streamlined assembly processes. With a surface mount design, this component supports signal applications, making it a preferred choice in various electronic assemblies. The header is crafted from high-quality materials that ensure optimal performance and durability, even in demanding environments. Designed to meet industry standards, it ensures compatibility and compliance while offering a straightforward solution for your PCB connectivity needs.

Vertical orientation optimises space on your PCB

Breakaway design simplifies the assembly process

Nickel underplating enhances contact durability

Surface mount technology offers ease of handling during production

Low-temperature solder capability allows compatibility with a variety of soldering applications

Signal application focus ensures reliable communication between circuit boards

Black colour ensures clear visibility of solder joints

Parallel board-to-board configuration accommodates diverse layout requirements

Related links