TE Connectivity PT30 XFP Series Vertical Board Mount PCB Header, 29 Contact(s), 1.27mm Pitch, 1 Row(s), Unshrouded
- RS Stock No.:
- 474-654
- Mfr. Part No.:
- 1735869-1
- Brand:
- TE Connectivity
Subtotal (1 reel of 300 units)*
£797.82
(exc. VAT)
£957.38
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 22 December 2025
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Reel(s) | Per Reel | Per unit* |
|---|---|---|
| 1 + | £797.82 | £2.659 |
*price indicative
- RS Stock No.:
- 474-654
- Mfr. Part No.:
- 1735869-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Series | PT30 XFP | |
| Pitch | 1.27mm | |
| Number of Contacts | 29 | |
| Number of Rows | 1 | |
| Body Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mounting Type | Board Mount | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Series PT30 XFP | ||
Pitch 1.27mm | ||
Number of Contacts 29 | ||
Number of Rows 1 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Board Mount | ||
- COO (Country of Origin):
- CN
The TE Connectivity SAS backplane receptacle is expertly engineered for vertical surface mounting, offering an innovative solution for seamless connectivity. Designed for high-performance applications, it enhances data transmission through its advanced configuration featuring 29 positions in a single row. This receptacle ensures superior durability and reliability, making it an ideal choice for varied circuit applications involving both power and signal. Crafted with high-temperature housing materials, it withstands challenging environments without compromising performance. Its thoughtful design facilitates effortless integration with compatible connectors, ensuring optimal functionality across a range of electronic devices.
Surface mount termination method for efficient PCB integration
Highly resilient thermoplastic housing ensures longevity
Vertical PCB mount orientation optimises space utilisation
Nickel underplating and gold mating area plating enhance connection reliability
Low halogen content supports eco-friendly initiatives
Designed for robust performance in high-temperature conditions
Reflow solder capable for ease of manufacturing
Complies with EU RoHS and ELV directives for environmental safety
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