TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 1.27 mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 pack of 150 units)*

£202.65

(exc. VAT)

£243.18

(inc. VAT)

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Pack(s)
Per Pack
Per unit*
1 +£202.65£1.351

*price indicative

RS Stock No.:
473-654
Mfr. Part No.:
5-104178-6
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3.6A

Pitch

1.27mm

Number of Contacts

10

Housing Material

Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Copper Alloy

Minimum Operating Temperature

65°C

Row Pitch

1.27mm

Termination Type

Solder

Tail Pin Length

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS

Voltage

30 V

Distrelec Product Id

304-50-851

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a versatile connector designed for board-to-board applications, featuring an intricate structure suitable for high-density environments. This component boasts an unshrouded design, allowing easy access for mating connections while maintaining a secure fit. With a vertical orientation and a 10-position configuration, it is optimised for tight spaces without compromising functionality. Its robust construction, crafted from high-quality materials, ensures reliable performance across a wide temperature range and various operating conditions. A perfect solution for modern electronic assemblies, this header offers enhanced reliability and efficiency, making it ideal for a wide spectrum of applications in the electronics industry.

Designed for ease of use in tight spaces

Efficiently accommodates high-density connections

Crafted from durable materials for long-lasting performance

Offers reliable connection integrity under various conditions

Optimised for compatibility with contemporary electronic systems

Enables straightforward mating with minimal alignment concerns

Provides excellent thermal and electrical stability in operation

Supports through-hole soldering for robust assembly

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