TE Connectivity AMPMODU Series Vertical Surface PCB Header, 70 Contact(s), 1.27 mm Pitch, 2 Row(s), Shrouded

Subtotal (1 tube of 18 units)*

£198.25

(exc. VAT)

£237.90

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£198.25£11.014

*price indicative

RS Stock No.:
520-644
Mfr. Part No.:
5-104894-7
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

0.5A

Pitch

1.27mm

Housing Material

Liquid Crystal Polymer

Number of Contacts

70

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Surface

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Row Pitch

1.27mm

Maximum Operating Temperature

105°C

Standards/Approvals

UL 94 V-0

Distrelec Product Id

304-54-154

COO (Country of Origin):
MX
The TE Connectivity PCB mount header is designed for vertical assembly in board-to-board applications, offering a reliable connection for various electronic circuits. Featuring a 70-position configuration and a 1.27 mm centreline, it ensures a compact footprint while maintaining exceptional performance efficiency. The fully shrouded design enhances its robustness, preventing accidental disconnections and providing a secure connection even in high-density designs. Additionally, with gold plating on the contact mating area, it effectively enhances conductivity and resistance against corrosion. This connector is ideal for modern electronic devices requiring high reliability and durability in extreme operating conditions.

Optimised for a parallel board-to-board configuration

Constructed from liquid crystal polymer for excellent thermal stability

Features a standard connector profile for easy integration

The contact shape is round, providing reliable connectivity

Polarisation aids in correct mating alignment during assembly

Meets industry standards with a UL flammability rating of UL 94V-0

Low halogen content ensures a minimal environmental impact

Designed for reflow solder processes, accommodating assembly efficiency

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