TE Connectivity 2.54 mm Pitch 28 Way DIP DIP IC Socket

Subtotal (1 tube of 51 units)*

£241.02

(exc. VAT)

£289.22

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£241.02£4.726

*price indicative

RS Stock No.:
468-991
Distrelec Article No.:
304-63-269
Mfr. Part No.:
2-1571551-9
Brand:
TE Connectivity
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Brand

TE Connectivity

Package Type

DIP

IC Socket Type

DIP

Product Type

IC Socket

Current

3A

Number of Contacts

28

Number of Rows

2

Pitch

2.54mm

Orientation

Vertical

Contact Material

Beryllium Copper Alloy

Contact Plating

Gold Flash

Row Pitch

2.54mm

Termination Type

Solder

Device Mount Type

Board

Maximum Operating Temperature

265°C

Standards/Approvals

UL 94 V-0

Housing Material

Thermoplastic

COO (Country of Origin):
CH
The TE Connectivity Sophisticated dual in-line package (DIP) socket designed for seamless integration into electronic circuits. This product stands out with its robust construction, featuring high-quality materials that ensure longevity and reliable performance in demanding applications. Engineered for versatility, it is suitable for a range of PCB layouts, facilitating both assembly and maintenance. The socket's design incorporates features that promote efficient signal transmission, making it an ideal choice for various electronic projects and products needing dependable interconnect solutions. Its compact profile aids in effective space utilization on the PCB, while its vertical orientation optimises connection integrity, ensuring optimal functionality. Whether for prototyping or final products, this DIP socket exemplifies precision and efficiency in modern electronic design.

Designed for effective signal transfer in diverse electronic applications

Offers a closed frame style for enhanced protection and stability

Compatible with through-hole soldering for easy integration into PCB layouts

Constructed with nickel sleeve material for improved durability

Provides a black thermoplastic housing, contributing to a sleek design

Employs a four-fingered mating contact type for superior connectivity

Offers board mounting for secure installation and operation

Ideal for use in high-temperature solder processes

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