TE Connectivity 2.54 mm Pitch 16 Way DIP Board IC Socket
- RS Stock No.:
- 478-503
- Distrelec Article No.:
- 304-63-264
- Mfr. Part No.:
- 2-1437539-8
- Brand:
- TE Connectivity
Subtotal (1 pack of 120 units)*
£191.60
(exc. VAT)
£229.92
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 13 March 2026
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Pack(s) | Per Pack | Per unit* |
|---|---|---|
| 1 + | £191.60 | £1.597 |
*price indicative
- RS Stock No.:
- 478-503
- Distrelec Article No.:
- 304-63-264
- Mfr. Part No.:
- 2-1437539-8
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Package Type | DIP | |
| Current | 3A | |
| Number of Contacts | 16 | |
| Number of Rows | 2 | |
| Pitch | 2.54mm | |
| Orientation | Vertical | |
| Contact Plating | Gold | |
| Row Pitch | 2.54mm | |
| Termination Type | Solder | |
| Socket Mount Type | Board | |
| Maximum Operating Temperature | 265°C | |
| Standards/Approvals | China RoHS 2 Directive MIIT Order No 32, 2016 Restricted Materials Above Threshold, EU REACH Regulation (EC) No. 1907/2006 | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Package Type DIP | ||
Current 3A | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Pitch 2.54mm | ||
Orientation Vertical | ||
Contact Plating Gold | ||
Row Pitch 2.54mm | ||
Termination Type Solder | ||
Socket Mount Type Board | ||
Maximum Operating Temperature 265°C | ||
Standards/Approvals China RoHS 2 Directive MIIT Order No 32, 2016 Restricted Materials Above Threshold, EU REACH Regulation (EC) No. 1907/2006 | ||
Non Compliant
- COO (Country of Origin):
- CH
The TE Connectivity Socket assembly is a highly efficient and reliable DIP socket designed for seamless integration with printed circuit boards. Engineered to accommodate 16 positions, this standard socket offers optimal performance in various electronic applications. Its robust open frame style facilitates easy insertion and removal of ICs, while the stamped and formed contact fabrication ensures a strong electrical connection. The combination of gold plating on the contact mating area enhances durability and conductance, making this socket ideal for demanding environments. With a vertical PCB mount orientation, this component is well-suited for space-constrained designs, ensuring that you can maximise functionality without compromising on device footprint.
Designed for standard, stamped and formed applications
Features gold plating for superior conductivity and durability
Offers easy integration with vertical PCB mount orientation
Optimised for 16 positions to support multiple applications
Provides reliable wave soldering capabilities
Facilitates enhanced electrical performance in various environments
Streamlined open frame design allows for quick IC changes
Supports widespread usage across various electronic manufacturing sectors
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