TE Connectivity 2.54 mm Pitch 8 Way DIP DIP IC Socket

Currently unavailable
We don't know if this item will be back in stock, RS intend to remove it from our range soon.
RS Stock No.:
467-619
Distrelec Article No.:
304-63-268
Mfr. Part No.:
2-1571551-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

IC Socket

Package Type

DIP

IC Socket Type

DIP

Number of Contacts

8

Current

3A

Number of Rows

2

Pitch

2.54mm

Orientation

Vertical

Contact Material

Beryllium Copper Alloy

Contact Plating

Gold Flash

Termination Type

Solder

Device Mount Type

Board

Row Pitch

2.54mm

Maximum Operating Temperature

265°C

Standards/Approvals

UL 94 V-0

Housing Material

Thermoplastic

COO (Country of Origin):
CH
The TE Connectivity DIP socket connector embodies a blend of precision and innovation, making it an ideal solution for enhancing connectivity in printed circuit boards. Engineered for reliability, it features a closed frame style with gold flash plating in the contact mating area, ensuring optimal performance in various electronic applications. Designed for standard configurations, this versatile component accommodates eight positions across two rows, while its compact dimensions make it suitable for a wide array of designs. The connector boasts a vertical PCB mount orientation and offers a robust mechanical attachment with secure mating alignment for seamless integration. With compliance to industry standards, it provides assurance of quality in performance and safety.

Configured for effective termination to the printed circuit board

Offers vertical PCB mount orientation for space efficiency

Includes a closed frame style that enhances durability

Utilises robust gold flash for stable electrical connections

Designed for easy integration with a standard pitch and alignment

Supports a maximum contact current rating of 3 A for reliable operation

Constructed with a thermoplastic housing to resist environmental stress

Facilitates wave solder capability for simplified assembly

Complies with EU directives for environmentally friendly usage

Delivers effective signal circuit applications for high-performance electronics

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