TE Connectivity Holsworthy RP73 976 Ω, 0603 Thin Film Resistor 0.1 % Surface 0.166 W - 1-2176088-2

Subtotal (1 reel of 2000 units)*

£274.00

(exc. VAT)

£328.00

(inc. VAT)

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Units
Per unit
Per Reel*
2000 +£0.137£274.00

*price indicative

RS Stock No.:
477-428
Distrelec Article No.:
304-58-917
Mfr. Part No.:
1-2176088-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

Resistor

Resistance

976Ω

Resistor Type

Precision

Technology

Thin Film

Package/Case

0603

Packaging

Tape & Reel

Tolerance

0.1 %

Voltage

100 V

Power Rating

0.166W

Temperature Coefficient

±25 ppm/°C

Mount Type

Surface

Automotive Standard

No

Pin Count

2

Series

Holsworthy RP73

Width

0.8 mm

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU

Height

0.45mm

Length

1.55mm

COO (Country of Origin):
TW
The TE Connectivity precision resistor is designed for the discerning engineer seeking reliability and accuracy. Built with a thin film element construction, it offers exceptional performance in compact applications, enhancing circuit stability. Pioneering its class, this surface mount resistor combines a nominal resistance of 976 ohms with a remarkable power rating of 0.166 watts, making it ideal for various electronic circuits. Encased in a 0603 package size, its compact form factor allows for easy integration into modern electronic designs. The resistor's minimal tolerance of 0.1 % ensures precise measurements, meeting the demands of high-performance applications. With its low temperature coefficient of ±25 ppm/°C, it provides stable performance across varying temperatures, making it a reliable choice for critical systems. Hence, it is an ideal solution for engineers looking to optimise their designs without compromising on quality or space.

Surface mount design for straightforward PCB integration

Thin film technology ensures high precision and performance

Compact 0603 package is perfect for space-constrained applications

Low temperature coefficient promotes stable operation under thermal fluctuations

Suitable for high-density electronic assemblies due to minimal footprint

Meets compliance standards for a range of environmental regulations

Taped and reeled packaging facilitates easy handling and automated assembly

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