Molex 50242 Series Vertical Board PCB Socket, 14-Contact, 2 Row, 0.4 mm Pitch Surface Mount

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Subtotal (1 reel of 3000 units)*

£1,321.43

(exc. VAT)

£1,585.72

(inc. VAT)

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  • Shipping from 23 February 2026
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Reel(s)
Per Reel
Per unit*
1 +£1,321.43£0.44

*price indicative

RS Stock No.:
478-770
Distrelec Article No.:
304-56-447
Mfr. Part No.:
502426-1430
Brand:
Molex
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Brand

Molex

Product Type

PCB Socket

Number of Contacts

14

Number of Rows

2

Sub Type

PCB Receptacle

Current

0.3A

Pitch

0.4mm

Termination Type

Surface Mount

Mount Type

Board

Orientation

Vertical

Stacking Height

1mm

Voltage

50 V

Series

50242

Minimum Operating Temperature

-40°C

Row Pitch

0.4mm

Contact Material

Phosphor Bronze

Contact Plating

Gold

Maximum Operating Temperature

85°C

Standards/Approvals

chemSHERPA, IEC-62474, IPC 1752A Class C, IPC 1752A Class D

COO (Country of Origin):
JP
The TE Connectivity board-to-board receptacle redefines connectivity with its innovative design tailored for contemporary PCB requirements. Engineered to provide reliable and efficient performance, it features a 0.40mm pitch and a dual-row arrangement, accommodating a high circuit density of 14 circuits. The vertical configuration and low stacking height of 1.00mm make it ideal for compact applications, ensuring that it seamlessly integrates into space-constrained environments. Crafted with precision, this receptacle boasts solder tabs and comes with vacuum tape, facilitating straightforward assembly and enhancing reliability. With robust compliance features to global standards, it is an excellent choice for manufacturers seeking a dependable solution for signal transmission across various electronic applications.

Designed for surface mount applications, ensuring ease of integration

Utilises phosphor bronze for superior conductivity and durability

Gold plating enhances resistance to corrosion and ensures longevity

Offers a temperature range of -40° to +85°C, making it suitable for diverse environments

Durability ratings of 30 mating cycles guarantee long-lasting performance

Embossed tape packaging simplifies handling and placement in automated processes

The vertical orientation optimises space in multilayer PCB designs

Includes PCB retention features for secure attachment during operation

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