TE Connectivity AMPMODU Series Vertical Through Hole PCB Header, 2 Contact(s), 2.54mm Pitch, 1 Row(s), Unshrouded

The TE Connectivity PCB mount header is engineered for vertical mounting and designed to facilitate reliable board-to-board connections. This innovative component features a breakaway design that optimises circuit space while ensuring robust connectivity. Its 2.54 mm (.1 in) centreline offers compatibility with a variety of PCB designs, and its through-hole solder termination method enhances the stability and durability of the mounting. Tailored for performance across diverse application environments, this header is poised to meet the demanding standards of modern electronics. Enhanced by gold and nickel plating, it stands out for its conductivity and resistance to corrosion, ensuring long-lasting functionality in any assembly. Ideal for both prototyping and final production applications, this header is a crucial element in developing efficient and effective electronic solutions.

Engineered for ultra-reliable board-to-board connectivity
Breakaway design supports flexible circuit configurations
Compatible with a variety of PCB layouts for enhanced versatility
Durable materials ensure longevity and resistance to wear
Optimised for high-performance applications across various industries
Ideal for prototyping, making it a go-to choice for designers
Efficient solder termination method promotes electrical integrity
Designed to withstand a broad operating temperature range for diverse environments