TE Connectivity 5-103 Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 481-075
- Mfr. Part No.:
- 5-103168-3
- Brand:
- TE Connectivity
Subtotal (1 tray of 80 units)*
£281.46
(exc. VAT)
£337.75
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 24 November 2025
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Tray(s) | Per Tray | Per unit* |
---|---|---|
1 + | £281.46 | £3.518 |
*price indicative
- RS Stock No.:
- 481-075
- Mfr. Part No.:
- 5-103168-3
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Series | 5-103 | |
Pitch | 2.54mm | |
Number of Contacts | 10 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Through Hole | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Series 5-103 | ||
Pitch 2.54mm | ||
Number of Contacts 10 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Through Hole | ||
- COO (Country of Origin):
- MX
The TE Connectivity PCB Mount Header is expertly designed for robust signal transmission, establishing a reliable board-to-board connection with its vertical orientation. Built with a fully shrouded rectangular shape, this component offers exceptional durability and protection for critical applications. With a 2.54 mm centreline, it ensures effortless integration into your circuit design. The high-quality gold plating enhances conductivity while the nickel underplating serves to prevent corrosion, ensuring long-lasting performance. Designed for a maximum operating temperature of 105 °C, this header can withstand the rigours of demanding environments. Its parallel configuration allows for fully loaded connector contact, making it a strong contender for modern electronic applications.
Utilises high-grade thermoplastic housing for added durability
Offers a parallel board-to-board configuration for enhanced connectivity
Incorporates a detent window for secure mating retention
Allows through-hole solder termination for reliable circuit board attachment
Designed with a compact footprint for space-efficient deployments
Features a standard connector profile, simplifying mounting procedures
Optimised for high insulation resistance, promoting signal integrity
Provides compatibility with various industry standards for flexibility in application
Capable of wave soldering processes, extending its usability in manufacturing
Offers a parallel board-to-board configuration for enhanced connectivity
Incorporates a detent window for secure mating retention
Allows through-hole solder termination for reliable circuit board attachment
Designed with a compact footprint for space-efficient deployments
Features a standard connector profile, simplifying mounting procedures
Optimised for high insulation resistance, promoting signal integrity
Provides compatibility with various industry standards for flexibility in application
Capable of wave soldering processes, extending its usability in manufacturing
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