TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Subtotal (1 tray of 80 units)*

£219.62

(exc. VAT)

£263.54

(inc. VAT)

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  • Shipping from 16 February 2026
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Tray(s)
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Per unit*
1 +£219.62£2.745

*price indicative

RS Stock No.:
472-069
Distrelec Article No.:
304-50-803
Mfr. Part No.:
5-103168-4
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Number of Contacts

12

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Tin

Contact Material

Phosphor Bronze

Minimum Operating Temperature

-65°C

Termination Type

Solder

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA, RoHS, UL

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is engineered for versatile connectivity solutions, ensuring seamless board-to-board connections with its fully shrouded design. This robust header accommodates 12 positions on a 2.54 mm centreline, making it an ideal choice for compact applications requiring high reliability. With a vertical orientation and solder-through hole termination, it is designed to integrate effortlessly into a wide range of electronic assemblies. Crafted from high-quality thermoplastic and featuring nickel underplating, this component supports exceptional electrical performance while maintaining durability across diverse environments. Its compatibility with industry standards guarantees optimal functionality, while the exceptional insulation resistance and dielectric withstanding voltage specifications make it ideal for signal circuit applications, delivering unparalleled performance.

Fully shrouded design for enhanced protection against environmental factors

Vertical orientation optimises space utilisation in compact designs

High insulation resistance ensures reliable performance over time

Nickel contact underplating supports superior conductivity

Thermoplastic housing material offers excellent durability

Designed for board-to-board applications, facilitating easy connections

Polarisation allows for secure and accurate mating

Wave solder capable, enhancing assembly efficiency

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