TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 12 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded
- RS Stock No.:
- 471-891
- Mfr. Part No.:
- 1-103735-1
- Brand:
- TE Connectivity
Subtotal (1 tube of 112 units)*
£175.76
(exc. VAT)
£210.91
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 26 November 2025
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tube(s) | Per Tube | Per unit* |
---|---|---|
1 + | £175.76 | £1.569 |
*price indicative
- RS Stock No.:
- 471-891
- Mfr. Part No.:
- 1-103735-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Series | AMPMODU | |
Pitch | 2.54mm | |
Number of Contacts | 12 | |
Number of Rows | 1 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Board Mount | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Pitch 2.54mm | ||
Number of Contacts 12 | ||
Number of Rows 1 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Board Mount | ||
Non Compliant
- COO (Country of Origin):
- MX
The TE Connectivity PCB Mount Header is a versatile interconnect solution designed for seamless wire-to-board connections in various electronic applications. Featuring a fully shrouded design, this connector boasts a compact 12-position configuration with a 2.54 mm centreline, making it ideal for space-constrained environments. Engineered for reliability, the header ensures a secure electrical connection through its through-hole solder termination method. The robust construction facilitates ease of installation, while the high-quality materials selected enhance the performance across a wide operating temperature range. This product is an essential choice for engineers seeking dependable connectivity solutions in demanding conditions.
Compact design optimised for space efficiency
Fully shrouded to provide protection against environmental factors
Reliable wire to board connection for improved signal integrity
Solder termination method enables strong lasting connections
Thermoplastic housing ensures longevity and durability
Mating retention mechanism enhances connection stability
Fully shrouded to provide protection against environmental factors
Reliable wire to board connection for improved signal integrity
Solder termination method enables strong lasting connections
Thermoplastic housing ensures longevity and durability
Mating retention mechanism enhances connection stability
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