TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 20 Contact(s), 2.54mm Pitch, 2 Row(s), Shrouded
- RS Stock No.:
- 480-397
- Mfr. Part No.:
- 103168-8
- Brand:
- TE Connectivity
Subtotal (1 box of 88 units)*
£424.93
(exc. VAT)
£509.92
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 01 December 2025
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Box(es) | Per Box | Per unit* |
---|---|---|
1 + | £424.93 | £4.829 |
*price indicative
- RS Stock No.:
- 480-397
- Mfr. Part No.:
- 103168-8
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Series | AMPMODU | |
Pitch | 2.54mm | |
Number of Contacts | 20 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Shrouded | |
Mounting Type | Board Mount | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Pitch 2.54mm | ||
Number of Contacts 20 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mounting Type Board Mount | ||
- COO (Country of Origin):
- US
The TE Connectivity PCB mount header is specifically designed for vertical board-to-board applications, offering a robust solution with 20 positions on a 2.54 mm centerline. Featuring a fully shrouded design, the connector ensures secure and reliable connectivity while protecting against potential misalignment during mating. The premium materials used include gold-plated contacts for enhanced conductivity and a thermoplastic housing that withstands harsh environmental conditions. This connector assembly is ideal for applications requiring a reliable connection in compact spaces, making it the optimal choice for manufacturers aiming to maintain quality and performance in their electronic designs.
Fully shrouded design aids in preventing misalignment
Nickel underplating enhances the durability of the contacts
Polarization feature simplifies the mating process
Wave solder capability ensures compatibility with automated assembly
Suitable for a broad operating temperature range
Compact dimensions allow for efficient use of space
Standard row-to-row spacing facilitates integration into existing designs
Meets various industry standards for compliance assurance
Nickel underplating enhances the durability of the contacts
Polarization feature simplifies the mating process
Wave solder capability ensures compatibility with automated assembly
Suitable for a broad operating temperature range
Compact dimensions allow for efficient use of space
Standard row-to-row spacing facilitates integration into existing designs
Meets various industry standards for compliance assurance
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