TE Connectivity AMPMODU MOD II Series Straight Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 2 Row(s), Shrouded

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Subtotal (1 unit)*

£3.77

(exc. VAT)

£4.52

(inc. VAT)

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1 - 19£3.77
20 - 74£3.62
75 - 299£3.42
300 - 599£3.25
600 +£3.17

*price indicative

Packaging Options:
RS Stock No.:
718-9084
Distrelec Article No.:
302-68-410
Mfr. Part No.:
103168-3
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU MOD II

Pitch

2.54mm

Current

3A

Number of Contacts

10

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board, Wire-to-Board

Mount Type

Through Hole

Contact Material

Phosphor Bronze

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

-65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

No

Distrelec Product Id

30268410

TE Connectivity 2.54mm AMPMODU MOD II Standard Profile Double Row Shrouded Headers


2.54mm AMPMODU MOD II standard profile double row shrouded headers with an end dimension of 1.68mm and 0.64mm straight square posts. These AMPMODU MOD II double row 2.54mm shrouded headers are vertical PCB through hole mounting with a detent window mating connector lock and black UL 94V-0 thermoplastic GF housings. The contacts of these AMPMODU MOD II shrouded PCB headers are available with different plating options: Part numbers X-103168-X are duplex plated with 0.00076mm gold plating, part numbers X-102618-X are duplex plated with 0.00038mm gold plating. For suitable mating connectors see stock numbers 680-3445 and 745-4952 typically.

2.54mm TE Connectivity AMPMODU Mod II Interconnect System


The AMPMODU Interconnect system is the signal standard for automation and control applications and is both reliable and economical. The AMPMODU Interconnect system consists of board to board, wire to board and wire to wire connectors with a Compact design. When combined, these connectors can be used in a wide variety of industrial applications and systems

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