TE Connectivity AMPMODU Series Horizontal Board Mount PCB Header, 12 Contact(s), 2.54mm Pitch, 1 Row(s), Unshrouded
- RS Stock No.:
- 476-770
- Mfr. Part No.:
- 2-87499-1
- Brand:
- TE Connectivity
Subtotal (1 bag of 90 units)*
£194.74
(exc. VAT)
£233.69
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 24 November 2025
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Bag(s) | Per Bag | Per unit* |
---|---|---|
1 + | £194.74 | £2.164 |
*price indicative
- RS Stock No.:
- 476-770
- Mfr. Part No.:
- 2-87499-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | TE Connectivity | |
Series | AMPMODU | |
Pitch | 2.54mm | |
Number of Contacts | 12 | |
Number of Rows | 1 | |
Body Orientation | Horizontal | |
Shrouded/Unshrouded | Unshrouded | |
Mounting Type | Board Mount | |
Select all | ||
---|---|---|
Brand TE Connectivity | ||
Series AMPMODU | ||
Pitch 2.54mm | ||
Number of Contacts 12 | ||
Number of Rows 1 | ||
Body Orientation Horizontal | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Board Mount | ||
- COO (Country of Origin):
- MX
The TE Connectivity Housing receptacle for wire-to-board applications delivers a perfect blend of performance and reliability. With its 12-position capacity and crimp-style termination, this product is designed to seamlessly connect wires to PCB layouts requiring compact solutions. Tailored for signal transmission within the AMPMODU IV/V series, it features a 2.54 mm centerline, ensuring compatibility with various PCB designs. Boasting a sleek black thermoplastic body, this housing not only enhances the aesthetic appeal but also ensures durability even in challenging environments. Ideal for diverse industries, it underscores TE Connectivity's commitment to excellence in connector technology, making it a must-have for modern electronic assemblies. This product has been engineered to meet stringent electrical characteristics while ensuring compliance with global standards.
Robust design optimized for wire-to-board connectivity
Inline contact layout enhances signal integrity
Thermoplastic housing material provides exceptional resilience
Compact dimensions facilitate integration into tight spaces
Low termination resistance ensures efficient electrical conduction
Inline contact layout enhances signal integrity
Thermoplastic housing material provides exceptional resilience
Compact dimensions facilitate integration into tight spaces
Low termination resistance ensures efficient electrical conduction
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