TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 pack of 224 units)*

£210.82

(exc. VAT)

£252.98

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 08 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per unit*
1 +£210.82£0.941

*price indicative

RS Stock No.:
473-873
Mfr. Part No.:
535541-6
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Fibreglass Polyester

Number of Contacts

8

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Tail Pin Length

3.18mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL E28476

Voltage

333 V

Non Compliant

COO (Country of Origin):
CN
The TE Connectivity Connector System is designed for seamless integration in various electronic applications. This PCB mount receptacle features a vertical orientation and is optimised for board-to-board connections, enabling efficient signal transfer across devices. With eight positions arranged in a single row and a .1 inch centreline, it ensures compact design and maximised performance. The robust construction, including gold-plated contacts and a standard connector profile, guarantees reliable connectivity while accommodating a wide operating temperature range. Its innovative design allows for easy installation through soldering, making it an ideal choice for both prototyping and mass production. Enhanced with a superior dielectric withstand voltage, it promises durability and longevity in demanding environments.

Robust design supports reliable board-to-board connectivity

Vertical orientation optimises space in electronic assemblies

Dielectric withstand voltage ensures enhanced safety during operation

Compact size allows for efficient circuit board layout

Gold plating enhances corrosion resistance and conductivity

Compatible with standard through-hole soldering techniques

Has a wide operating temperature range for versatile applications

Lightweight construction helps reduce overall assembly weight

Related links