TE Connectivity AMPMODU Series Vertical Board PCB Header, 8 Contact(s), 2.54 mm Pitch, 1 Row(s), Unshrouded

Subtotal (1 pack of 200 units)*

£188.32

(exc. VAT)

£225.98

(inc. VAT)

Add to Basket
Select or type quantity
Temporarily out of stock
  • Shipping from 08 January 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s)
Per Pack
Per unit*
1 +£188.32£0.942

*price indicative

RS Stock No.:
473-605
Mfr. Part No.:
5-146278-8
Brand:
TE Connectivity
Find similar products by selecting one or more attributes.
Select all

Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

8

Housing Material

Glass Filled Liquid Crystal Polymer

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Tin Plated

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.05mm

Standards/Approvals

No

Voltage

30 V

Distrelec Product Id

304-50-887

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is a cutting-edge connector designed for vertical board-to-board applications, featuring eight positions and a 2.54 mm centreline spacing. This connector excels in facilitating secure and efficient connections in various electronic assemblies, ensuring reliability and performance in demanding environments. Made from high-quality materials, the header offers excellent electrical characteristics, including a 30 VAC operating voltage. Its breakaway design not only simplifies integration but also enhances flexibility in circuit designs, making it ideal for both prototyping and production. With compatibility to both CSA and UL standards, this product represents a blend of practicality and compliance, confirming its place in innovative electronic solutions.

Connector system optimised for board-to-board configurations

Standard connector profile ensures a streamlined integration process

Designed to accommodate high temperatures with a robust housing material

Offers a through-hole solder termination method for enhanced stability

Features enhanced current ratings, ensuring reliability in demanding applications

Nickel underplating ensures improved conductivity and longevity

Breakaway design promotes easy modification and integration in various setups

Available in bulk quantities, ideal for large-scale assembly projects

Related links