onsemi PowerTrench Dual N/P-Channel MOSFET, 7.3 A, 8.6 A, 30 V, 8-Pin SOIC FDS8858CZ

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Subtotal (1 reel of 2500 units)*

£762.50

(exc. VAT)

£915.00

(inc. VAT)

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Per Reel*
2500 +£0.305£762.50

*price indicative

RS Stock No.:
124-1715
Mfr. Part No.:
FDS8858CZ
Brand:
onsemi
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Brand

onsemi

Channel Type

N, P

Maximum Continuous Drain Current

7.3 A, 8.6 A

Maximum Drain Source Voltage

30 V

Series

PowerTrench

Package Type

SOIC

Mounting Type

Surface Mount

Pin Count

8

Maximum Drain Source Resistance

17 mΩ, 21 mΩ

Channel Mode

Enhancement

Minimum Gate Threshold Voltage

1V

Maximum Power Dissipation

1.6 W

Transistor Configuration

Isolated

Maximum Gate Source Voltage

-25 V, -20 V, +20 V, +25 V

Typical Gate Charge @ Vgs

17 nC @ 10 V, 33 nC @ 10 V

Length

5mm

Width

4mm

Number of Elements per Chip

2

Maximum Operating Temperature

+150 °C

Transistor Material

Si

Height

1.5mm

Minimum Operating Temperature

-55 °C

PowerTrench® Dual N/P-Channel MOSFET, Fairchild Semiconductor


PowerTrench® MOSFETs are optimised power switches that offer increase of system efficiency and power density. They combine small gate charge(Qg), small reverse recovery charge(Qrr) and soft reverse recovery body diode, which contributes to fast switching of synchronous rectification in AC/DC power supplies.
The latest PowerTrench® MOSFETs, employ shielded-gate structure that provides charge balance. By utilizing this advanced technology, the FOM (Figure of Merit) of these devices is significant lower than that of previous generation.
Soft body diode performance of the PowerTrench® MOSFETs is able to eliminate snubber circuit or replace a higher voltage rating MOSFET.


MOSFET Transistors, ON Semi


ON Semi offers a substantial portfolio of MOSFET devices that includes high-voltage (>250V) and low-voltage (<250V) types. The advanced silicon technology provides smaller die sizes, which it is incorporated into multiple industry-standard and thermally-enhanced packages.
ON Semi MOSFETs provide superior design reliability from reduced voltage spikes and overshoot, to lower junction capacitance and reverse recovery charge, to elimination of additional external components to keep systems up and running longer.

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