TE Connectivity 0.99 mm Pitch 3647 Way Board IC Socket
- RS Stock No.:
- 476-267
- Distrelec Article No.:
- 304-59-425
- Mfr. Part No.:
- 2-2822979-4
- Brand:
- TE Connectivity
Subtotal (1 tray of 3 units)*
£219.64
(exc. VAT)
£263.57
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 18 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | £219.64 | £73.213 |
*price indicative
- RS Stock No.:
- 476-267
- Distrelec Article No.:
- 304-59-425
- Mfr. Part No.:
- 2-2822979-4
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Current | 0.5A | |
| Number of Contacts | 3647 | |
| Pitch | 0.99mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Socket Mount Type | Board | |
| Row Pitch | 0.99mm | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, 2016 | |
| Housing Material | High Temperature Thermoplastic | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Current 0.5A | ||
Number of Contacts 3647 | ||
Pitch 0.99mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Socket Mount Type Board | ||
Row Pitch 0.99mm | ||
Termination Type Solder | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, 2016 | ||
Housing Material High Temperature Thermoplastic | ||
- COO (Country of Origin):
- CN
The TE Connectivity LGA3647-1 SOCKET-P1 KIT is a cutting-edge solution designed for original design manufacturers (ODMs) requiring high-performance connectivity. This state-of-the-art socket kit offers an innovative approach to ensuring reliable connections while managing thermal efficiency. Tailored for advanced computing applications, its square frame design simplifies integration into various printed circuit boards. With a meticulous focus on durability and performance, this socket kit stands as a testament to modern engineering, catering to the demands of sophisticated electronics that require exceptional performance and precision.
Offers superior contact current ratings enhancing reliability during operation
Manufactured from high temperature thermoplastic ensuring longevity under stress
Features low halogen content aligning with environmental compliance standards
Utilises surface mount solder ball termination method for efficient PCB integration
Showcases a black housing colour contributing to aesthetic uniformity in designs
Provides precision grid spacing allowing flexibility in layout designs