TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket
- RS Stock No.:
- 468-903
- Distrelec Article No.:
- 304-59-463
- Mfr. Part No.:
- 2174988-2
- Brand:
- TE Connectivity
Subtotal (1 pack of 8 units)*
£165.28
(exc. VAT)
£198.34
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 11 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Pack(s) | Per Pack | Per unit* |
|---|---|---|
| 1 + | £165.28 | £20.66 |
*price indicative
- RS Stock No.:
- 468-903
- Distrelec Article No.:
- 304-59-463
- Mfr. Part No.:
- 2174988-2
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Number of Contacts | 2011 | |
| Current | 0.5A | |
| Pitch | 1.02mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 1.02mm | |
| Socket Mount Type | Board | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant | |
| Housing Material | High Temperature Thermoplastic | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Number of Contacts 2011 | ||
Current 0.5A | ||
Pitch 1.02mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 1.02mm | ||
Socket Mount Type Board | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant | ||
Housing Material High Temperature Thermoplastic | ||
- COO (Country of Origin):
- CN
The TE Connectivity Socket assembly is expertly crafted for LGA 2011 applications, providing superior durability with a gold-plated contact mating area. This component is designed to ensure seamless signal integrity while effectively dissipating heat, making it an optimal choice for high-performance computing environments. The combination of high-temperature thermoplastic housing and finely tuned specifications ensures that this product meets the rigorous demands of modern electronic designs. Emphasising reliability, it features a square frame style for secure mounting, positioning it as an essential element in advanced circuit applications. Enhanced by a surface mount solder ball termination method, this product guarantees exceptional connections to printed circuit boards, paving the way for robust and efficient operational capabilities.
Designed to support advanced LGA 2011 socket connections
Utilises gold (Au) for contact mating area plating, enhancing conductivity
Constructed from high-temperature thermoplastic for superior durability
Facilitates reliable board-to-board connectivity with optimal grid spacing
Maintenance of signal integrity allows for better performance in high-speed applications
Low halogen content ensures compliance with environmental regulations
Allows for reflow solder capability up to 260°C, aiding manufacturing flexibility
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