TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket

RS Stock No.:: 468-903
Distrelec Article No.:: 304-59-463
Mfr. Part No.:: 2174988-2
Brand:: TE Connectivity

TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket

Subtotal (1 pack of 8 units)*

£165.28

(exc. VAT)

£198.34

(inc. VAT)

Stock information currently inaccessible - Please check back later

Pack(s)	Per Pack	Per unit*
1 +	£165.28	£20.66

*price indicative

RS Stock No.:: 468-903
Distrelec Article No.:: 304-59-463
Mfr. Part No.:: 2174988-2
Brand:: TE Connectivity

Specifications

Technical Reference

Legislation and Compliance

Product Details

Find similar products by selecting one or more attributes.

Select all	Attribute	Value
	Brand	TE Connectivity
	Product Type	IC Socket
	Number of Contacts	2011
	Current	0.5A
	Pitch	1.02mm
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Termination Type	Solder
	Socket Mount Type	Board
	Row Pitch	1.02mm
	Maximum Operating Temperature	260°C
	Standards/Approvals	EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant
	Housing Material	High Temperature Thermoplastic

	Select all
	Brand TE Connectivity
	Product Type IC Socket
	Number of Contacts 2011
	Current 0.5A
	Pitch 1.02mm
	Contact Material Copper Alloy
	Contact Plating Gold
	Termination Type Solder
	Socket Mount Type Board
	Row Pitch 1.02mm
	Maximum Operating Temperature 260°C
	Standards/Approvals EU ELV Directive 2000/53/EC Compliant, UL 94V-0, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU Compliant
	Housing Material High Temperature Thermoplastic

Datasheet - 2174988-2

COO (Country of Origin):: CN

The TE Connectivity Socket assembly is expertly crafted for LGA 2011 applications, providing superior durability with a gold-plated contact mating area. This component is designed to ensure seamless signal integrity while effectively dissipating heat, making it an optimal choice for high-performance computing environments. The combination of high-temperature thermoplastic housing and finely tuned specifications ensures that this product meets the rigorous demands of modern electronic designs. Emphasising reliability, it features a square frame style for secure mounting, positioning it as an essential element in advanced circuit applications. Enhanced by a surface mount solder ball termination method, this product guarantees exceptional connections to printed circuit boards, paving the way for robust and efficient operational capabilities.

Designed to support advanced LGA 2011 socket connections

Utilises gold (Au) for contact mating area plating, enhancing conductivity

Constructed from high-temperature thermoplastic for superior durability

Facilitates reliable board-to-board connectivity with optimal grid spacing

Maintenance of signal integrity allows for better performance in high-speed applications

Low halogen content ensures compliance with environmental regulations

Allows for reflow solder capability up to 260°C, aiding manufacturing flexibility

TE Connectivity 1.02 mm Pitch 2011 Way Board IC Socket

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