TE Connectivity 1.02 mm Pitch 30 Way IC Socket
- RS Stock No.:
- 480-344
- Distrelec Article No.:
- 304-57-867
- Mfr. Part No.:
- 1-1554653-1
- Brand:
- TE Connectivity
Subtotal (1 tray of 6 units)*
£207.47
(exc. VAT)
£248.96
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 11 March 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Tray(s) | Per Tray | Per unit* |
|---|---|---|
| 1 + | £207.47 | £34.578 |
*price indicative
- RS Stock No.:
- 480-344
- Distrelec Article No.:
- 304-57-867
- Mfr. Part No.:
- 1-1554653-1
- Brand:
- TE Connectivity
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | TE Connectivity | |
| Product Type | IC Socket | |
| Number of Contacts | 30 | |
| Current | 0.5A | |
| Pitch | 1.02mm | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Termination Type | Solder | |
| Row Pitch | 1.02mm | |
| Device Mount Type | Board | |
| Maximum Operating Temperature | 260°C | |
| Standards/Approvals | EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, UL 94V-0, 2016 | |
| Housing Material | High Temperature Thermoplastic | |
| Select all | ||
|---|---|---|
Brand TE Connectivity | ||
Product Type IC Socket | ||
Number of Contacts 30 | ||
Current 0.5A | ||
Pitch 1.02mm | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Termination Type Solder | ||
Row Pitch 1.02mm | ||
Device Mount Type Board | ||
Maximum Operating Temperature 260°C | ||
Standards/Approvals EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, UL 94V-0, 2016 | ||
Housing Material High Temperature Thermoplastic | ||
- COO (Country of Origin):
- CN
The TE Connectivity SOCKET ASSY LGA2011 is engineered to provide exceptional connectivity for high-performance applications. This advanced IC socket is specifically designed to accommodate devices with 2011 positions within a compact and robust structure. With its surface mount solder ball termination method, it ensures reliable operation in demanding environments. The socket's square frame design enhances stability while the high-temperature thermoplastic housing material guarantees durability. It is particularly ideal for configurations requiring a high pin count, making it an essential component in modern electronic systems. Additionally, compliance with industry standards such as UL 94V-0 reinforces its credibility and safety for diverse applications.
Optimised for high performance applications requiring 2011 positions
Durable construction using high temperature thermoplastic material
Square frame design elevates stability and ease of integration
Surface mount technology enables compact PCB layouts
Gold plated contact area ensures superior electrical conductivity
Low halogen materials contribute to environmentally friendly manufacturing
Reflow solder capability supports efficient assembly processes
Compliant with EU RoHS and REACH regulations
Versatile application in board to board configurations
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