Amphenol Communications Solutions 400 Way SMT BGA Prototyping IC Socket
- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
Subtotal (1 reel of 250 units)*
£5,428.75
(exc. VAT)
£6,514.50
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 02 April 2026
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Reel* |
---|---|---|
250 + | £21.715 | £5,428.75 |
*price indicative
- RS Stock No.:
- 182-2279
- Mfr. Part No.:
- 74221-101LF
- Brand:
- Amphenol Communications Solutions
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Amphenol Communications Solutions | |
IC Socket Type | Prototyping Socket | |
Package Type | BGA | |
Gender | Female | |
Number of Contacts | 400 | |
Contact Material | Copper Alloy | |
Contact Plating | Gold | |
Current Rating | 450.0mA | |
Socket Mounting Type | Surface Mount | |
Device Mounting Type | Surface Mount | |
Voltage Rating | 200.0 V | |
Termination Method | Through Hole | |
Housing Material | Liquid Crystal Polymer | |
Select all | ||
---|---|---|
Brand Amphenol Communications Solutions | ||
IC Socket Type Prototyping Socket | ||
Package Type BGA | ||
Gender Female | ||
Number of Contacts 400 | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Current Rating 450.0mA | ||
Socket Mounting Type Surface Mount | ||
Device Mounting Type Surface Mount | ||
Voltage Rating 200.0 V | ||
Termination Method Through Hole | ||
Housing Material Liquid Crystal Polymer | ||
- COO (Country of Origin):
- US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
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