Amphenol Communications Solutions 400 Way SMT BGA Prototyping IC Socket

Subtotal (1 reel of 250 units)*

£5,428.75

(exc. VAT)

£6,514.50

(inc. VAT)

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  • Shipping from 02 April 2026
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Units
Per unit
Per Reel*
250 +£21.715£5,428.75

*price indicative

RS Stock No.:
182-2279
Mfr. Part No.:
74221-101LF
Brand:
Amphenol Communications Solutions
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Brand

Amphenol Communications Solutions

IC Socket Type

Prototyping Socket

Package Type

BGA

Gender

Female

Number of Contacts

400

Contact Material

Copper Alloy

Contact Plating

Gold

Current Rating

450.0mA

Socket Mounting Type

Surface Mount

Device Mounting Type

Surface Mount

Voltage Rating

200.0 V

Termination Method

Through Hole

Housing Material

Liquid Crystal Polymer

COO (Country of Origin):
US
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options

400 Position BGA Receptacle, 4 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free

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