TE Connectivity 23276 Series Vertical Edge Connector Female, Board, 56-Contacts, 0.6 mm Pitch, 2 Row, Surface Mount

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Subtotal (1 reel of 350 units)*

£1,323.54

(exc. VAT)

£1,588.25

(inc. VAT)

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  • Ready to ship from 25 May 2026
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Reel(s)
Per Reel
Per unit*
1 +£1,323.54£3.782

*price indicative

RS Stock No.:
470-958
Distrelec Article No.:
304-64-005
Mfr. Part No.:
2327679-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Orientation

Vertical

Product Type

Edge Connector

Number of Contacts

56

Current

1.1A

Number of Rows

2

Connector Gender

Female

Pitch

0.6mm

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Termination Type

Surface Mount

Minimum Operating Temperature

-55°C

Contact Gender

Female

Maximum Operating Temperature

85°C

Standards/Approvals

Gen-Z, China RoHS 2 Directive MIIT Order No 32, 2016, EU REACH Regulation (EC) No. 1907/2006, EU RoHS Directive 2011/65/EU, EU ELV Directive 2000/53/EC, EDSFF

Series

23276

Card Type

PCB Edge Card

COO (Country of Origin):
CN
The TE Connectivity Advanced internal I/O connector is designed specifically for high-performance applications requiring reliable signal integrity and optimal performance. The connector leverages cutting-edge technology to seamlessly connect printed circuit boards with vertical cable-to-board orientation, ensuring compact integration. Featuring a robust surface mount design, it supports a substantial number of 56 positions, making it ideal for sophisticated electronic devices that demand precision. Its construction incorporates high-quality materials, ensuring durability and longevity in various operational environments. With an operating temperature range from -55°C to 85°C, this connector is perfect for diverse applications across multiple industries including data storage and telecommunications. Embracing compliance with EU RoHS directives, it reflects a commitment to sustainable manufacturing practices without sacrificing performance.

Optimised for vertical PCB edge card applications

High reliability with a signal circuit application design

Features a low profile to enhance space efficiency within enclosures

Constructed to withstand rigorous stress and environmental conditions

Supports significant current ratings for demanding applications

Utilises tin and gold plating for enhanced contact performance

Perfectly suited for integration into EDSFF and Gen Z compliant systems

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