TE Connectivity CGS RLP73 270 mΩ, 1206 Thick Film Surface Mount Resistor 5 % Surface 0.5 W - 3-2176056-5

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Subtotal (1 reel of 5000 units)*

£310.00

(exc. VAT)

£370.00

(inc. VAT)

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Units
Per unit
Per Reel*
5000 +£0.062£310.00

*price indicative

RS Stock No.:
476-074
Distrelec Article No.:
304-51-905
Mfr. Part No.:
3-2176056-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

Surface Mount Resistor

Resistance

270mΩ

Technology

Thick Film

Resistor Type

Current

Package/Case

1206

Tolerance

5 %

Packaging

Tape & Reel

Power Rating

0.5W

Mount Type

Surface

Temperature Coefficient

±200 ppm/°C

Automotive Standard

No

Pin Count

2

Series

CGS RLP73

Width

1.55 mm

Height

0.55mm

Length

3.1mm

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant with Exemptions, EU RoHS Directive 2011/65/EU Compliant with Exemptions

COO (Country of Origin):
TW
The TE Connectivity robust surface mount current sensing resistor is expertly designed to meet the growing demands of modern electronic applications. With its .27 ohm resistance value and high precision thick film element, it delivers outstanding performance and reliability. The 1206 package size allows for seamless integration into various PCB designs, ensuring minimal footprint while maintaining effective thermal management. This resistor is highly efficient, operating at a power rating of .5 W, making it suitable for a diverse range of applications from automotive to industrial automation. The ±200 ppm/°C temperature coefficient ensures stable performance under varying temperature conditions, allowing for accurate sensing in critical circuits. With a commitment to quality, this product offers compliance with international RoHS and ELV regulations, making it a responsible choice for environmentally-conscious designs.

Surface mount technology allows for efficient space utilization on PCBs

Thick film construction provides enhanced heat resistance and longevity

Designed for current sensing applications, optimizing circuit performance

Low height profile enhances integration into compact electronic devices

Solder termination ensures reliable connection and ease of assembly

Compliant with industry standards, facilitating global acceptance in designs

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