TE Connectivity AMPMODU Series Vertical Board PCB Header, 80 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

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Subtotal (1 pack of 7 units)*

£187.38

(exc. VAT)

£224.86

(inc. VAT)

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  • Shipping from 27 April 2026
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Pack(s)
Per Pack
Per unit*
1 +£187.38£26.769

*price indicative

RS Stock No.:
509-961
Distrelec Article No.:
304-50-755
Mfr. Part No.:
4-146494-0
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

80

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

2.54mm

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

CSA LR7189, UL E28476

Mating Pin Length

8.38mm

Non Compliant

COO (Country of Origin):
MX
The TE Connectivity PCB Mount Header is designed for vertical mounting and facilitates seamless board-to-board connections, making it ideal for compact applications requiring high-density interconnects. With an impressive 80 positions and a reliable 2.54 mm centreline, this unshrouded header ensures robust connectivity while supporting a variety of electronic configurations. The product's gold-plated contacts enhance conductivity and durability, ensuring excellent performance even in challenging conditions. Crafted from thermoplastic material, it withstands a wide operating temperature range, making it suitable for diverse environments. This header not only meets industry standards but also offers stackable configurations, allowing for versatile installation options in demanding applications.

Unshrouded design optimises space while maintaining connection integrity

Offers a high contact rating of 3 A for enhanced performance

Thermoplastic housing provides excellent durability and heat resistance

Compatible with wave soldering processes, facilitating efficient assembly

Features a copper alloy contact base for improved electrical conductivity

Stackable design enhances flexibility in multi-layered applications

The product is compliant with prominent industry standards for reliable use

Included packaging quantity of 75 ensures sufficient supply for medium-scale projects

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