Molex 50330 Series Vertical Surface PCB Header, 40 Contact(s), 0.4 mm Pitch, 2 Row(s), Unshrouded

Subtotal (1 reel of 3000 units)*

£3,964.32

(exc. VAT)

£4,757.18

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£3,964.32£1.321

*price indicative

RS Stock No.:
480-922
Mfr. Part No.:
503308-4010
Brand:
Molex
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Brand

Molex

Product Type

PCB Header

Series

50330

Current

0.3A

Pitch

0.4mm

Number of Contacts

40

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Contact Plating

Gold

Contact Material

Copper Alloy

Row Pitch

0.4mm

Termination Type

Surface Mount

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

85°C

Standards/Approvals

REACH, RoHS

Voltage

50 V

Distrelec Product Id

304-62-349

COO (Country of Origin):
JP
The TE Connectivity Plug assembly offers dependable board-to-board connectivity with a compact 0.40mm pitch design. Ideal for modern electronic applications, it features a dual row configuration that accommodates up to 40 circuits, ensuring efficient signal transmission. The vertical orientation facilitates easy integration into space-constrained designs, while the robust design guarantees reliable performance through a maximum of 30 mating cycles. Its surface mount termination style enhances assembly efficiency and reduces footprint, making it an excellent choice for high-density applications.

Delivers a reliable connection for board-to-board applications

Designed with a space-saving architecture to optimise PCB layouts

Supports a maximum current of 0.3A per contact for effective power delivery

Offers temperature resilience, functioning optimally between -40° to +85°C

Compliant with RoHS and halogen-free standards for environmentally conscious choices

Utilises high-quality copper alloy for improved conductivity

Features gold plating on mating surfaces to ensure long-lasting performance

Has an embossed tape packaging type for secure and efficient shipping

Incorporates PCB retention for enhanced stability and connection integrity

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