Molex 50330 Series Vertical Surface Mount PCB Header, 16 Contact(s), 0.4mm Pitch, 2 Row(s), Unshrouded
- RS Stock No.:
- 480-919
- Mfr. Part No.:
- 503304-1640
- Brand:
- Molex
Subtotal (1 reel of 3000 units)*
£1,734.40
(exc. VAT)
£2,081.28
(inc. VAT)
FREE delivery for orders over £50.00
Temporarily out of stock
- Shipping from 28 November 2025
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Reel(s) | Per Reel | Per unit* |
---|---|---|
1 + | £1,734.40 | £0.578 |
*price indicative
- RS Stock No.:
- 480-919
- Mfr. Part No.:
- 503304-1640
- Brand:
- Molex
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Molex | |
Series | 50330 | |
Pitch | 0.4mm | |
Number of Contacts | 16 | |
Number of Rows | 2 | |
Body Orientation | Vertical | |
Shrouded/Unshrouded | Unshrouded | |
Mounting Type | Surface Mount | |
Select all | ||
---|---|---|
Brand Molex | ||
Series 50330 | ||
Pitch 0.4mm | ||
Number of Contacts 16 | ||
Number of Rows 2 | ||
Body Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mounting Type Surface Mount | ||
- COO (Country of Origin):
- JP
The TE Connectivity 0.40mm pitch board-to-board receptacle is ingeniously designed for efficient space-saving connections in applications demanding precision and reliability. With a dual-row vertical configuration and a stacking height of just 0.70mm, this connector seamlessly integrates into compact PCB designs, ensuring robust connectivity without sacrificing performance. The solution is particularly well-suited for applications ranging from consumer electronics to industrial equipment, offering versatility and durability under various environmental conditions. Its low-halogen status further underscores a commitment to sustainable practices, aligning with industry standards for environmentally conscious components.
Designed for a compact footprint, enabling space-efficient designs
Dual-row configuration allows for increased circuit density
Vertical orientation simplifies alignment in assembly processes
Low-stacking height reduces overall profile in the application
Compliant with EU RoHS regulations, ensuring safety and sustainability
Strong mating retention for reliable connections in demanding environments
Compatible with both standard and custom PCB designs
Dual-row configuration allows for increased circuit density
Vertical orientation simplifies alignment in assembly processes
Low-stacking height reduces overall profile in the application
Compliant with EU RoHS regulations, ensuring safety and sustainability
Strong mating retention for reliable connections in demanding environments
Compatible with both standard and custom PCB designs
Related links
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