TE Connectivity AMP HPI Series Vertical Board PCB Header, 12 Contact(s), 1.25 mm Pitch, 1 Row(s), Shrouded

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Subtotal (1 reel of 1000 units)*

£2,246.44

(exc. VAT)

£2,695.73

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£2,246.44£2.246

*price indicative

RS Stock No.:
480-480
Mfr. Part No.:
1-1734260-2
Brand:
TE Connectivity
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Brand

TE Connectivity

Series

AMP HPI

Product Type

PCB Header

Pitch

1.25mm

Current

3A

Number of Contacts

12

Housing Material

High Temperature Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Plating

Nickel

Contact Material

Phosphor Bronze

Row Pitch

1.25mm

Termination Type

Surface Mount

Standards/Approvals

2016, China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, EU RoHS 2011/65/EU, UL 94V-0

Voltage

125 V

Distrelec Product Id

304-63-833

COO (Country of Origin):
CN
The TE Connectivity 1.25 WTB HDR SMT, 12 contact is an advanced printed circuit board connector designed to enhance the reliability of wire-to-board applications. Featuring a partially shrouded header type, this connector ensures secure connections while maintaining a compact form factor. Built for vertical mounting, the connector is ideal for space-constrained designs. The high-quality construction includes natural high-temperature thermoplastic housing and phosphor bronze contacts, ensuring durability in demanding environments. This connector supports fully loaded conditions up to 125 VDC, making it suitable for a variety of signal circuit applications. Engineered for efficiency, the product is compliant with industry standards, ensuring you receive a solution that meets your design specifications.

Engineered for vertical PCB mounting to optimize space usage

Supports robust signal applications for dependable performance

High-quality materials provide durability and longevity

Matte-finished plating enhances contact reliability

Solder peg retention ensures solid attachment to PCB

Designed for easy integration in various electronic systems

Packaging quantity of 1000 units for efficient bulk processing

Reflow solder capable, handling temperatures up to 260°C

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