TE Connectivity AMP HPI Series Vertical Board PCB Header, 15 Contact(s), 1.25 mm Pitch, 1 Row(s), Shrouded

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£2,609.84

(exc. VAT)

£3,131.81

(inc. VAT)

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1 +£2,609.84£2.61

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RS Stock No.:
480-066
Mfr. Part No.:
1-1734260-5
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMP HPI

Pitch

1.25mm

Current

3A

Housing Material

High Temperature Thermoplastic

Number of Contacts

15

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Nickel, Tin

Termination Type

Surface Mount

Row Pitch

1.25mm

Maximum Operating Temperature

260°C

Standards/Approvals

China RoHS 2, EU ELV, EU RoHS, UL 94V-0

Voltage

125 V

Distrelec Product Id

304-48-243

COO (Country of Origin):
CN
The TE Connectivity 1.25 WTB HDR SMT and 15 position connector is designed to provide reliable wire-to-board connections in compact electronic applications. Constructed from high-temperature thermoplastic, this robust component ensures durability while maintaining excellent performance under varying conditions. Its vertical PCB mount orientation allows for efficient space utilization, making it ideal for modern circuit board designs. With a fully loaded configuration supporting 15 positions, it facilitates seamless signal transmission while adhering to strict industry standards. The connector's matte-finish plating and excellent contact materials ensure superior conductivity and longevity, delivering consistent performance in both industrial and consumer applications. This cutting-edge connector is not only compliant with the EU RoHS Directive but also meets various environmental regulations, demonstrating a commitment to sustainability and safety in electronic components.

Designed for high-performance wire-to-board applications

Features a partially shrouded header type for added protection

Constructed from materials meeting UL 94V-0 flammability standards

PCB contact termination areas employ tin plating for enhanced durability

Offers a reliable mating alignment system for secure connections

Integration of multiple terminations per post maximizes space efficiency

Facilitates reflow solder processes up to 260°C for versatility in manufacturing

Includes polarization features for intuitive mating and assembly

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