TE Connectivity AMP Mini CT Series Vertical Surface PCB Header, 36 Contact(s), 1.5 mm Pitch, 2 Row, Shrouded

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Subtotal (1 reel of 400 units)*

£738.81

(exc. VAT)

£886.57

(inc. VAT)

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Reel(s)
Per Reel
Per unit*
1 +£738.81£1.847

*price indicative

RS Stock No.:
474-324
Distrelec Article No.:
304-54-023
Mfr. Part No.:
3-292229-6
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

PCB Header

Series

AMP Mini CT

Current

2A

Pitch

1.5mm

Housing Material

Nylon Fibreglass

Number of Contacts

36

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin Plated

Row Pitch

1.5mm

Termination Type

Surface Mount

Minimum Operating Temperature

30°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Mating Pin Length

2.4mm

Standards/Approvals

CSA, CSA LR7189, UL, UL 94V-0, UL E28476

Voltage

50 V

COO (Country of Origin):
CN
The TE Connectivity PCB Mount Header is designed for superior performance in wire-to-board applications, optimising space and offering a high-density connection solution. With a vertical orientation and fully shrouded design, this header ensures reliable and consistent connectivity for various electronic systems. Its 36 positions enable integration into compact layouts without compromising on strength or signal integrity. Constructed from durable Nylon-GF housing, it performs exceptionally well under a wide temperature range, assuring long-lasting operation in diverse environments. Ideal for signal applications, this header is your go-to connector for effective electronic design.

Constructed with a fully shrouded design for enhanced protection

Compatible with standard surface mount assembly processes

Offers a square contact shape for stable electrical connectivity

Incorporates polarisation features for accurate mating

Designed with staggered contact layouts to improve signal performance

Meets rigorous agency standards ensuring reliability and safety

Supplied in packaging quantities suitable for high volume applications

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