Infineon HEXFET N-Channel MOSFET, 140 A, 30 V, 3-Pin D2PAK IRL3803STRLPBF
- RS Stock No.:
- 217-2638
- Mfr. Part No.:
- IRL3803STRLPBF
- Brand:
- Infineon
Save 18% when you buy 500 units
Subtotal (1 pack of 10 units)*
£14.50
(exc. VAT)
£17.40
(inc. VAT)
FREE delivery for orders over £50.00
In Stock
- 90 unit(s) ready to ship
Need more? Click ‘Check delivery dates’ to find extra stock and lead times.
Units | Per unit | Per Pack* |
---|---|---|
10 - 40 | £1.45 | £14.50 |
50 - 90 | £1.378 | £13.78 |
100 - 240 | £1.32 | £13.20 |
250 - 490 | £1.262 | £12.62 |
500 + | £1.175 | £11.75 |
*price indicative
- RS Stock No.:
- 217-2638
- Mfr. Part No.:
- IRL3803STRLPBF
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
---|---|---|
Brand | Infineon | |
Channel Type | N | |
Maximum Continuous Drain Current | 140 A | |
Maximum Drain Source Voltage | 30 V | |
Series | HEXFET | |
Package Type | D2PAK (TO-263) | |
Mounting Type | Surface Mount | |
Pin Count | 3 | |
Maximum Drain Source Resistance | 9 mO | |
Maximum Gate Threshold Voltage | 1V | |
Number of Elements per Chip | 1 | |
Select all | ||
---|---|---|
Brand Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 140 A | ||
Maximum Drain Source Voltage 30 V | ||
Series HEXFET | ||
Package Type D2PAK (TO-263) | ||
Mounting Type Surface Mount | ||
Pin Count 3 | ||
Maximum Drain Source Resistance 9 mO | ||
Maximum Gate Threshold Voltage 1V | ||
Number of Elements per Chip 1 | ||
The Infineon 30V Single N-Channel IR MOSFET in a D2-Pak package.
Planar cell structure for wide Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
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