Infineon HEXFET N-Channel MOSFET, 89 A, 55 V, 3-Pin D2PAK IRL3705NSTRLPBF
- RS Stock No.:
- 217-2635
- Mfr. Part No.:
- IRL3705NSTRLPBF
- Brand:
- Infineon
Save 4% when you buy 1600 units
Subtotal (1 reel of 800 units)*
£609.60
(exc. VAT)
£731.20
(inc. VAT)
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- Shipping from 18 December 2025
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Units | Per unit | Per Reel* |
|---|---|---|
| 800 - 800 | £0.762 | £609.60 |
| 1600 + | £0.724 | £579.20 |
*price indicative
- RS Stock No.:
- 217-2635
- Mfr. Part No.:
- IRL3705NSTRLPBF
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 89 A | |
| Maximum Drain Source Voltage | 55 V | |
| Series | HEXFET | |
| Package Type | D2PAK (TO-263) | |
| Mounting Type | Surface Mount | |
| Pin Count | 3 | |
| Maximum Drain Source Resistance | 10 mO | |
| Maximum Gate Threshold Voltage | 2V | |
| Number of Elements per Chip | 1 | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 89 A | ||
Maximum Drain Source Voltage 55 V | ||
Series HEXFET | ||
Package Type D2PAK (TO-263) | ||
Mounting Type Surface Mount | ||
Pin Count 3 | ||
Maximum Drain Source Resistance 10 mO | ||
Maximum Gate Threshold Voltage 2V | ||
Number of Elements per Chip 1 | ||
The Infineon 55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package.
Planar cell structure for wide SOA
Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
Optimized for broadest availability from distribution partners
Product qualification according to JEDEC standard
Silicon optimized for applications switching below <100kHz
Industry standard surface-mount power package
High-current carrying capability package (up to 195 A, die-size dependent)
Capable of being wave-soldered
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