Vishay E Type N-Channel Power MOSFET, 2.9 A, 800 V Enhancement, 3-Pin TO-252

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RS Stock No.:
188-4874
Mfr. Part No.:
SIHD2N80AE-GE3
Brand:
Vishay
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Brand

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

2.9A

Maximum Drain Source Voltage Vds

800V

Series

E

Package Type

TO-252

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

2.9Ω

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

30V

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

62.5W

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

7nC

Maximum Operating Temperature

150°C

Width

6.22mm

Height

2.25mm

Length

6.73mm

Standards/Approvals

RoHS

Automotive Standard

No

Vishay Series E Power MOSFET, 800V Drain Source Voltage, 2.9A Maximum Continuous Drain Current - SIHD2N80AE-GE3


This power MOSFET is a high-voltage switching transistor intended for use in industrial and electronics systems where robust voltage handling and thermal endurance are required. It operates as an enhancement-mode N-channel device designed for surface-mount installation and is suited to power conversion and control tasks in automation and electrical equipment.

Features and Benefits:


• 800V rating enables high-voltage switching in Compact designs • 2.9A continuous drain current supports moderate load currents • 7nC typical gate charge for efficient gate-drive energy management • 2.9Ω Rds(on) limits conduction losses under light-to-moderate loads • 62.5W power dissipation allows sustained thermal loading • -55°C to 150°C operating range for elevated-temperature applications

Applications


• Suitable for high-voltage rail switching in industrial converters • Ideal for power-stage use in motor drives with moderate currents • Used for line-side switching in power supplies and inverters • Can be used for transient suppression and snubber circuits in AC systems

What gate voltage range should I observe for control circuitry?


The device tolerates gate-source voltages up to 30V, so gate drivers should be specified to remain within this maximum to prevent gate degradation.

How does mounting affect thermal performance?


As a surface-mounted TO-252 package, thermal transfer relies on good PCB copper area and thermal vias to dissipate the device’s rated power

insufficient copper will raise junction temperature.

What package pin count and configuration are provided?


The component is supplied in a three-pin TO-252 configuration suitable for standard surface-mount assembly processes.

How should I account for forward conduction behaviour in design?


The reported forward voltage is 1.2V

include this in loss calculations when the body diode conducts during reverse-recovery or synchronous-rectification events.

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