Infineon 600V CoolMOS SiC N-Channel MOSFET, 30 A, 600 V, 22-Pin PG-HDSOP-22 IPQC60R017S7XTMA1
- RS Stock No.:
- 284-893
- Mfr. Part No.:
- IPQC60R017S7XTMA1
- Brand:
- Infineon
Unavailable
RS will no longer stock this product.
- RS Stock No.:
- 284-893
- Mfr. Part No.:
- IPQC60R017S7XTMA1
- Brand:
- Infineon
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Brand | Infineon | |
| Channel Type | N | |
| Maximum Continuous Drain Current | 30 A | |
| Maximum Drain Source Voltage | 600 V | |
| Package Type | PG-HDSOP-22 | |
| Series | 600V CoolMOS | |
| Mounting Type | Surface Mount | |
| Pin Count | 22 | |
| Channel Mode | Enhancement | |
| Transistor Material | SiC | |
| Number of Elements per Chip | 1 | |
Select all | ||
|---|---|---|
Brand Infineon | ||
Channel Type N | ||
Maximum Continuous Drain Current 30 A | ||
Maximum Drain Source Voltage 600 V | ||
Package Type PG-HDSOP-22 | ||
Series 600V CoolMOS | ||
Mounting Type Surface Mount | ||
Pin Count 22 | ||
Channel Mode Enhancement | ||
Transistor Material SiC | ||
Number of Elements per Chip 1 | ||
The Infineon MOSFET is a high performance power MOSFET designed for low frequency switching applications. Built using cutting edge CoolMOS S7 technology, this device provides exceptional energy efficiency and outstanding price performance characteristics. The product features a compact PG HDSOP 22 package that supports high pulse current capability and efficient thermal performance. With its low RDS(on) value, it ensures minimal conduction losses, making it an excellent choice for solid state relays, circuit breakers, and line rectification in various demanding applications like computing and telecom. This MOSFET stands out for its reliable operation, enhanced system performance, and a robust design that accommodates high current requirements while maintaining a long lifespan.
Optimised for high efficiency in static switching
Compact footprint for easy integration
High pulse current capacity for power applications
Kelvin Source pin enhances switching performance
Compliant with MSL1 for seamless assembly
Reduces need for bulky heat sinks
Faster switching times than electromechanical devices
Robust reliability under extreme conditions
Compact footprint for easy integration
High pulse current capacity for power applications
Kelvin Source pin enhances switching performance
Compliant with MSL1 for seamless assembly
Reduces need for bulky heat sinks
Faster switching times than electromechanical devices
Robust reliability under extreme conditions
Related links
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