TE Connectivity Bag Through Hole IC Socket

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Subtotal (1 bag of 650 units)*

£194.44

(exc. VAT)

£233.33

(inc. VAT)

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Bag(s)
Per Bag
Per unit*
1 +£194.44£0.299

*price indicative

RS Stock No.:
467-877
Distrelec Article No.:
304-62-914
Mfr. Part No.:
1-5380758-0
Brand:
TE Connectivity
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Brand

TE Connectivity

Package Type

Bag

Product Type

IC Socket

Current

4A

Contact Material

Beryllium Copper Alloy

Contact Plating

Tin

Minimum Operating Temperature

65°C

Termination Type

Solder

Socket Mount Type

Through Hole

Maximum Operating Temperature

125°C

Standards/Approvals

2016, EU ELV 2000/53/EC, EU RoHS 2011/65/EU, China RoHS 2 MIIT Order No 32

COO (Country of Origin):
US
The TE Connectivity miniature spring socket is designed for reliable cable-to-board connections, making it an essential component in various electronic applications. With an optimal socket length and precise PCB hole diameter, it ensures a secure fit with accessible wire sizes, enhancing performance and longevity. The closed-bottom design effectively houses discrete wires while maintaining a compact footprint, tailored to meet the rigorous demands of modern circuitry. Manufactured from high-quality materials, it provides exceptional electrical conductivity and resistance to wear, ideal for power and signal applications. Whether you're looking to improve your device's integrity or streamline assembly processes, this connection solution delivers excellent compatibility and efficiency.

Closed bottom design enhances wire retention and stability

Designed for through-hole press-fit termination for secure PCB integration

Constructed from beryllium copper for superior conductivity and durability

Rated for a maximum current of 4A, ideal for various power applications

Features low halogen materials, promoting environmental compliance

Compatible with a wide range of wire sizes, ensuring versatility in design

Enhanced plating for extended contact life and resistance to corrosion

Loose piece packaging facilitates easy handling and inventory management

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