TE Connectivity Bag IC Socket

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Subtotal (1 bag of 250 units)*

£210.86

(exc. VAT)

£253.03

(inc. VAT)

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Bag(s)
Per Bag
Per unit*
1 +£210.86£0.843

*price indicative

RS Stock No.:
467-724
Distrelec Article No.:
304-64-367
Mfr. Part No.:
1-5050871-0
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

IC Socket

Package Type

Bag

Current

7.5A

Contact Material

Beryllium Copper Alloy

Contact Plating

Gold

Termination Type

Solder

Minimum Operating Temperature

65°C

Maximum Operating Temperature

125°C

Standards/Approvals

China RoHS 2 MIIT Order No 32, EU ELV 2000/53/EC, 2016, EU RoHS 2011/65/EU

COO (Country of Origin):
US
The TE Connectivity miniature spring socket connector is designed specifically for seamless cable-to-board applications, offering a reliable and efficient connection for various electronic devices. With its open-bottom sleeve style, this socket ensures easy access for discrete wire attachments, making it an ideal choice in a variety of circuit designs. The robust construction features beryllium copper and gold plating, providing excellent conductivity and durability across operational ranges. Operating effectively in temperatures from -65 to 125 °C, this connector is engineered for resilience and long-term performance, perfect for power and signal circuitry. Whether you are building complex electronic assemblies or need reliable components for prototyping, this socket exceeds expectations with its flexible design and compliance with industry standards.

Supports both through-hole press-fit and solder termination methods

Allows for easy insertion with a hand or semi-automatic method

Compatible with a broad range of wire sizes for versatile connectivity

Constructed to handle high current ratings up to 7.5 A with confidence

Designed for low halogen content, addressing environmental compliance needs

Features a lightweight design that doesn’t compromise on strength or efficiency

Remarkably packaged for high-volume applications with a quantity of 2000 per bag

Enhanced with pin-in-paste capability to facilitate advanced solder processes

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