TE Connectivity, Z-PACK 1.9 mm Pitch High Speed High Speed Backplane Connector, Vertical Male, 8 Column, 15 Row, 120 Way

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Subtotal (1 tube of 28 units)*

£264.06

(exc. VAT)

£316.87

(inc. VAT)

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Tube(s)
Per Tube
Per unit*
1 +£264.06£9.431

*price indicative

RS Stock No.:
472-295
Distrelec Article No.:
304-49-452
Mfr. Part No.:
1934271-1
Brand:
TE Connectivity
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Brand

TE Connectivity

Product Type

High Speed Backplane Connector

Backplane Connector Type

High Speed

Number of Contacts

120

Current

0.5A

Number of Columns

8

Orientation

Vertical

Voltage

250 V

Connector Gender

Male

Number of Rows

15

Housing Material

Liquid Crystal Polymer

Pitch

1.9mm

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold, Tin

Minimum Operating Temperature

65°C

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

90°C

Standards/Approvals

2016, UL 94V-0, UL, China RoHS 2 Directive MIIT Order No 32, EU REACH Regulation (EC) No. 1907/2006, UL E28476, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant

Series

Z-PACK

COO (Country of Origin):
CN
The TE Connectivity 120 Position High Speed Backplane Connector is expertly engineered to facilitate seamless data transmission in high-performance applications. Designed with 15 rows and 8 columns, this PCB mount header is fully shrouded and features a 1.9 mm centreline, providing reliable connectivity in compact spaces. Its robust construction and impressive specifications ensure optimal signal integrity, making it an ideal choice for traditional backplane architectures. With an operating voltage of 250 VAC and an impedance of 100 Ω, this connector is built to handle demanding electrical environments while maintaining peak performance. Whether used in telecommunications, computing, or industrial systems, this component ensures durability and reliability across various applications, setting a benchmark in connector technology.

Robust construction for maximum durability in various environments

Optimised for high-speed data applications, supporting data rates of up to 10 Gb/s

Differential impedance maintains signal integrity for reliable performance

Vertical PCB mount orientation allows for effective space management

Advanced mating alignment features ensure secure connections during operation

Low halogen content supports environmentally responsible practices

Matte finish plating enhances resistance to wear and tear

Easy integration into traditional backplane architectures for versatile applications

Configured with compliant tail technology for improved retention during assembly

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