TGlobal TG Series Thermal Interface Pad, 1.5mm Thick, 2.2W/m·K, Silicone

SMC Dual-Rod Cylinders with slide bearings (CXSM type) or ball bearing slides (CXSL type), suitable for 'pick-and-place' applications, operating with non-lubricated, filtered, compressed air. Dual-Rod Cylinders feature high non-rotational accuracy, dual port locations, and standard magnetic sensing and buffer cushioning. Integral stroke adjustment may be set to standard stroke less 5mm. The cylinders incorporate a recess for auto switches, and may be used in operating environments from 5 to 60°C.

The TGlobal Ultra Soft Thermal Pad is a high-performance thermal interface material designed for high-power electronic applications. It features a single sticky side for easy assembly and offers high thermal conductivity, making it ideal for efficient heat dissipation. This thermal pad is suitable for use in a wide range of industries, including 5G, aerospace, AI, AIoT, AR/VR/MR/XR, automotive, consumer devices, Datacom, electric vehicles, electronic products, energy storage, industrial equipment, lighting, medical devices, military applications, Netcom, panels, power electronics, robotics, servers, smart home technologies, and telecommunications.

Ultra soft and good compressibility
Good insulation
RoHS and REACH compliant
UL Compliant